Company Filing History:
Years Active: 2024-2025
Title: Innovations by Junichi Kakehata
Introduction
Junichi Kakehata is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of electronics through his innovative patents. With a total of two patents to his name, Kakehata has focused on advancements in solder bump technology and connection structures.
Latest Patents
Kakehata's latest patents include a solder bump forming member and a method for manufacturing an electrode substrate provided with solder bumps. The solder bump forming member features a base substrate with multiple recesses and solder particles that have an average particle diameter of 1 to 35 μm. The design ensures that a part of the solder particle projects from the recess, optimizing the connection quality. His second patent details a connection structure that includes a first circuit member with first electrodes and a second circuit member with second electrodes. This innovative structure utilizes a tin-gold alloy and bismuth to enhance the bonding portions between the electrodes.
Career Highlights
Kakehata is currently employed at Resonac Corporation, where he continues to develop cutting-edge technologies. His work has been instrumental in improving the reliability and efficiency of electronic components.
Collaborations
Kakehata collaborates with talented coworkers, including Kunihiko Akai and Masayuki Miyaji. Their combined expertise contributes to the innovative environment at Resonac Corporation.
Conclusion
Junichi Kakehata's contributions to the field of electronics through his patents demonstrate his commitment to innovation. His work continues to influence the development of advanced electronic components, showcasing the importance of research and collaboration in technology.