The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Dec. 04, 2020
Applicant:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Inventors:

Kunihiko Akai, Tokyo, JP;

Masayuki Miyaji, Tokyo, JP;

Junichi Kakehata, Tokyo, JP;

Yoshinori Ejiri, Tokyo, JP;

Toshimitsu Moriya, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/02 (2006.01); H01L 23/00 (2006.01); H01R 4/58 (2006.01); H01R 12/52 (2011.01); H01R 12/61 (2011.01); H01R 12/62 (2011.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01R 4/02 (2013.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01R 4/58 (2013.01); H01R 12/52 (2013.01); H01R 12/613 (2013.01); H01R 12/62 (2013.01); H05K 1/181 (2013.01); H05K 3/323 (2013.01); H05K 3/3463 (2013.01); H05K 3/3478 (2013.01); H05K 3/3494 (2013.01); H05K 3/363 (2013.01); H05K 3/368 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29313 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/3201 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32505 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83905 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/066 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0675 (2013.01); H01L 2924/069 (2013.01); H01L 2924/07001 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/0705 (2013.01); H01L 2924/0715 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10977 (2013.01);
Abstract

A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.


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