The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Feb. 06, 2025
Resonac Corporation, Tokyo, JP;
Kunihiko Akai, Tokyo, JP;
Masayuki Miyaji, Tokyo, JP;
Junichi Kakehata, Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
RESONAC CORPORATION, Tokyo, JP;
Abstract
A solder bump forming member, a method for manufacturing a solder bump forming member, a method for manufacturing an electrode substrate provided with solder bumps. The solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 μm and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H, and a height of the solder particle is designated as H, H<His established.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile