This inventor holds 20 USPTO granted patents and 2 published patent applications and 14 EPO patents, primarily in Semiconductor Fabrication. Top assignees: Commissariat a L'energie Atomique Et Aux Energies Alternatives, S.o.i. Tec Silicon on Insulator Technologies of Chemin Des Franques, Soitec. Active years: 1999-2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- La Tronche, FR (1999)
- St Egreve, FR (2009)
- St. Egreve, FR (2012 - 2014)
- Sainte Egréve, FR (2016)
- Saint-Egreve, FR (2011 - 2020)
- Grenoble, FR (2001 - 2021)
Company Filing History:
20 out of 8,827 
1 out of 1 
1 out of 537 
Years Active: 1999-2021
Areas of Expertise:
Title: **Marc Zussy: Innovator in Bonding Technologies**
Introduction
Marc Zussy, based in Grenoble, France, is a prominent inventor with a remarkable portfolio of 20 patents. His work focuses on innovative bonding methods that have applications in various industrial sectors. Zussy’s contributions to the field of materials science highlight his expertise in creating effective adhesive solutions.
Latest Patents
Among Marc Zussy’s most recent patents is the **Temporary Bonding Method with Thermoplastic Adhesive Incorporating a Rigid Ring**. This method provides a robust approach to temporarily bond a substrate of interest to a handle substrate by utilizing a thermoplastic polymer. The process includes forming an assembly by bringing the bonding faces of both substrates into contact, followed by treating the assembly at a temperature exceeding the glass transition temperature of the polymer. This innovative assembly technique also involves creating a central cavity surrounded by a rigid peripheral ring before filling it with the thermoplastic polymer.
Another significant patent is the **Method for Wafer Trimming**. This invention focuses on trimming the edge of a wafer adhered to a support wafer through an interface layer. The method involves grinding the perimeter of the wafer, stopping precisely at the interface layer, which has a higher resistance to grinding. Moreover, the method allows for real-time detection to prevent overgrinding, ensuring precision in wafer processing.
Career Highlights
Marc Zussy has had an impressive career, notably working at the **Commissariat à l'Énergie Atomique et aux Énergies Alternatives** in France. His experience in such a renowned research institution underscores his commitment to advancing energy technologies through innovative solutions. Throughout his career, Zussy has mixed theoretical knowledge with practical applications, resulting in substantial contributions to the field.
Collaborations
In his journey as an inventor, Marc Zussy has collaborated with notable colleagues, including Hubert Moriceau and Bernard Aspar. These collaborations have fostered an environment of innovation, leading to the development of groundbreaking technologies in adhesive methods and materials processing.
Conclusion
Marc Zussy's dedication to innovation is evidenced by his patents and collaborations. His focus on advanced bonding techniques positions him as a significant figure in the realm of materials science. As he continues to explore new avenues in his field, Zussy's contributions are likely to have lasting impacts on the industry and inspire future generations of inventors.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile