The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Dec. 21, 2018
Applicant:
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Inventors:
Franck Fournel, Villard-Bonnot, FR;
Christophe Morales, St Pierre de Mesage, FR;
Marc Zussy, Saint Egreve, FR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 21/762 (2006.01); H01L 21/66 (2006.01); H01L 21/02 (2006.01); B24B 37/013 (2012.01); B24B 9/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); B24B 9/065 (2013.01); B24B 37/013 (2013.01); H01L 21/02087 (2013.01); H01L 21/76251 (2013.01); H01L 22/26 (2013.01);
Abstract
The invention aims for a wafer edge trimming methodadhered on a support waferby way of an interface layer. A zone at the perimeterof the waferis trimmed by grinding. The stopping of the grinding is advantageously done at the level of the interface layer. To do this, an interface layercomprising a transition layerhaving a resistance to grinding greater than that of the waferis used. According to a possibility, detecting an increase of the resistance to grinding during the grinding is done, so as to stop the grinding.