Hsinchu, Taiwan

Man-Hsuan Lin

USPTO Granted Patents = 6 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2019-2024

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6 patents (USPTO):Explore Patents

Title: Man-Hsuan Lin: Innovator in Silicon Carbide Technology

Introduction

Man-Hsuan Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of silicon carbide crystals. With a total of six patents to his name, Lin's work is recognized for its innovative approaches to reducing crystal defects in semiconductor materials.

Latest Patents

Among his latest patents, Lin has developed a silicon carbide crystal that includes a seed layer, a bulk layer, and a stress buffering structure formed between these layers. Each layer is designed with a dopant that cycles between high and low concentrations. This innovative structure significantly reduces crystal defects, enhancing the performance of silicon carbide materials. His patent titled "Silicon carbide crystal and method for manufacturing the same" further elaborates on this technology, emphasizing the importance of the stress buffering structure in maintaining the integrity of the crystal.

Career Highlights

Lin is currently employed at GlobalWafers Co., Ltd., a leading company in the semiconductor industry. His work at GlobalWafers has positioned him as a key player in advancing silicon carbide technology, which is crucial for various applications, including power electronics and high-temperature devices.

Collaborations

Lin collaborates with notable colleagues, including Chih-Yuan Chuang and Wen-Ching Hsu, who contribute to the innovative environment at GlobalWafers. Their teamwork fosters a culture of creativity and excellence in semiconductor research and development.

Conclusion

Man-Hsuan Lin's contributions to silicon carbide technology exemplify the impact of innovative thinking in the semiconductor industry. His patents not only advance the field but also pave the way for future developments in high-performance materials.

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