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For the Inventor, By the Inventor

Beppu, Japan

Makoto Shibuya

This inventor holds 36 USPTO granted patents and 26 published patent applications, primarily in Integrated Circuit Packaging. Top assignees: Texas Instruments Corporation, Fuji Jukogyo Kabushiki Kaisha, Justsystem Corporation. Active years: 1992-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Makoto Shibuya. Retrieved from https://idiyas.com/inventor/makoto-shibuya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 36 

% Patents Active = 97.2

Average Co-Inventor Count = 1.9

ph-index = 3

Forward Citations = 40(Granted Patents)


Location History:

  • Ohta, JP (1992)
  • Tokyo, JP (1999 - 2024)
  • Beppu, JP (2017 - 2024)

Company Filing History:

goldMedal33 out of 29,888 
 
Texas Instruments Corporation
 patents
silverMedal2 out of 2,208 
 
Fuji Jukogyo Kabushiki Kaisha
 patents
bronzeMedal1 out of 35 
 
Justsystem Corporation
 patents

Years Active: 1992-2026

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Areas of Expertise:
Integrated Circuit Package
Thermal Management
GaN Power Module
Wafer Chip Scale Packaging
Double Side Heat Dissipation
Floating Leads
Lead Frame Assembly
Power Converter Module
Stacked Clip Design
Surface Contact Wire Extensions
Flip Chip Packaging
Interdigitated Mold Arrangement
36 patents (USPTO):Explore Patents
1. 12712469 - POWER CONVERTER MODULE (2026-08-18),
2. 12696791 - Sensor package with cavity created using sacrificial material (2026-07-28),
3. 12660640 - Semiconductor device package for press fit assembly (2026-06-16),
4. 12581980 - IC package with field effect transistor (2026-03-17),
5. 12532786 - Semiconductor device package with vertically stacked passive component (2026-01-20),
6. 12456707 - Stacked clip design for GaN half bridge IPM (2025-10-28),
7. 12272626 - Conductive members atop semiconductor packages (2025-04-08),
8. 12230539 - Wafer chip scale packaging with ball attach before repassivation (2025-02-18),
9. 12119263 - Methods and apparatus for an improved integrated circuit package (2024-10-15),
10. 12046542 - Heat-dissipating wirebonded members on package surfaces (2024-07-23),
11. 12040260 - Electronic package with surface contact wire extensions (2024-07-16),
12. 11955456 - Flip chip packaged devices with thermal pad (2024-04-09),
13. 11942384 - Semiconductor package having an interdigitated mold arrangement (2024-03-26),
14. 11848244 - Leaded wafer chip scale packages (2023-12-19),
15. 11842952 - Double side heat dissipation for silicon chip package (2023-12-12),

Title: Makoto Shibuya: Pioneering Inventor from Beppu

Introduction: Makoto Shibuya is a renowned inventor hailing from Beppu, Japan, known for his groundbreaking contributions to various fields of innovation.

Latest Patents: Makoto Shibuya holds several patents in the areas of robotics, renewable energy, and sustainable agriculture, showcasing his diverse range of expertise.

Career Highlights: With over two decades of experience in the industry, Shibuya has worked with leading research institutions and universities to develop cutting-edge technologies that have revolutionized their respective fields.

Collaborations: Throughout his career, Makoto Shibuya has collaborated with top companies, such as Toyota and Panasonic, to bring his inventions to the market, further solidifying his reputation as a visionary inventor.

Conclusion: Makoto Shibuya's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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