The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

May. 11, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Makoto Shibuya, Beppu, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/4842 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 24/09 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 21/561 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01);
Abstract

In a described example, an integrated circuit (IC) package includes an IC die disposed on a die attach pad; a plurality of leads electrically connected to terminals on the IC die, the leads including a base metal; and molding compound material encapsulating portions of the IC die, the die attach pads, and the plurality of leads; the plurality of leads having a solder joint reinforcement tab. The solder joint reinforcement tabs include a first side, a second side opposite to the first side, a third side, a fourth side opposite to and in parallel to the third side, a fifth side forming an end portion of the solder joint reinforcement tab, the solder joint reinforcement tabs including a solderable metal layer on the second, third and fourth sides and on portions of the fifth side.


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