The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Feb. 09, 2022
Texas Instruments Incorporated, Dallas, TX (US);
Daiki Komatsu, Beppu, JP;
Makoto Shibuya, Tokyo, JP;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
An integrated circuit package includes a semiconductor die having a first surface and a second surface. The first surface is attached to a top surface of a die attach pad, and the second surface has a sensing area thereon. A mold compound covers or encapsulates at least a portion of the die attach pad and the semiconductor die. A channel is formed in a top portion of the mold compound. The channel extends from a first side of the mold compound to a second side of the mold compound. A cavity is formed between the channel and the sensing area so that the sensing area is exposed to the environment.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile