Tokyo, Japan

Makoto Orikasa

This inventor holds 29 USPTO granted patents and 2 published patent applications, primarily in Electronics Manufacturing. Top assignee: Tdk Corporation. Active years: 2014-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Makoto Orikasa. Retrieved from https://idiyas.com/inventor/makoto-orikasa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 93.1

Average Co-Inventor Count = 4.7

ph-index = 3

Forward Citations = 48(Granted Patents)


Company Filing History:


Years Active: 2014-2024

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Areas of Expertise:
Electroconductive Substrate
Wireless Communication Circuit
Noise Suppression Sheet
Semiconductor Package
Coil Component
Metal Mesh
Electronic Device
Wiring Substrate
Magnetic Head Device
Terminal Structure
Coating
Electronic Component Module
29 patents (USPTO):Explore Patents

Title: Makoto Orikasa: Innovating in Electroconductive Technologies

Introduction: Makoto Orikasa, based in Tokyo, Japan, is a prolific inventor with an impressive portfolio of 29 patents. His innovations primarily focus on electroconductive substrates and wireless communication technologies, contributing significantly to advancements in electronic devices.

Latest Patents: Among his latest inventions, two notable patents stand out. The first is for an electroconductive substrate that comprises a base material, a foundation layer, a trench formation layer, and an electroconductive pattern layer. This innovative design features a trench that is filled with the electroconductive pattern layer, which enhances the efficiency of electronic devices. The foundation layer includes a mixed region containing metal particles that integrate with the electroconductive pattern layer, making it a sophisticated solution for modern electronic applications.

The second patent pertains to a coil component and a wireless communication circuit utilizing this coil component. This invention illustrates a coil pattern formed on a substrate's surface, which is covered by a magnetic layer made from a composite material with dispersed magnetic particles. The unique flat shape of both the coil pattern and the magnetic particles is engineered for optimal performance, facilitating advanced communication capabilities.

Career Highlights: Makoto Orikasa has made significant contributions to the field of electroconductive technologies while working at TDK Corporation. His expertise in developing innovative electronic solutions has established him as a respected figure in the industry, with his patents playing a crucial role in the production of cutting-edge electronic devices.

Collaborations: Throughout his career, Orikasa has collaborated with talented individuals such as Yuhei Horikawa and Hisayuki Abe. Their combined efforts have driven innovation and enhanced the scope of their technological advancements, ensuring remarkable progress in their respective fields.

Conclusion: Makoto Orikasa continues to inspire with his inventive spirit and dedication to improving electronic technologies. His extensive patent portfolio reflects his commitment to innovation and collaboration, marking him as a pivotal figure in the landscape of modern electronics. As advancements in electroconductive and wireless communication technologies evolve, Orikasa's contributions will undoubtedly remain influential.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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