The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Jul. 18, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Takashi Daitoku, Tokyo, JP;

Susumu Taniguchi, Tokyo, JP;

Akiko Seki, Tokyo, JP;

Atsushi Sato, Tokyo, JP;

Yuhei Horikawa, Tokyo, JP;

Makoto Orikasa, Tokyo, JP;

Hisayuki Abe, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); C23C 18/20 (2006.01); H01L 33/62 (2010.01); G03F 7/00 (2006.01); C23C 18/18 (2006.01); C23C 18/16 (2006.01); C23C 18/30 (2006.01); C23C 18/31 (2006.01); C23C 18/38 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); C23C 18/1605 (2013.01); C23C 18/1882 (2013.01); C23C 18/1889 (2013.01); C23C 18/1893 (2013.01); C23C 18/206 (2013.01); C23C 18/208 (2013.01); C23C 18/2066 (2013.01); C23C 18/2086 (2013.01); C23C 18/30 (2013.01); C23C 18/31 (2013.01); G03F 7/0002 (2013.01); H01L 33/62 (2013.01); C23C 18/1608 (2013.01); C23C 18/1651 (2013.01); C23C 18/1879 (2013.01); C23C 18/38 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0753 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01); Y10S 977/887 (2013.01);
Abstract

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.


Find Patent Forward Citations

Loading…