The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Feb. 19, 2020
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Takasi Satou, Tokyo, JP;
Susumu Taniguchi, Tokyo, JP;
Hideyuki Kobayashi, Tokyo, JP;
Makoto Orikasa, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81805 (2013.01); H01L 2924/052 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.