The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2022
Filed:
Jul. 26, 2018
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Makoto Orikasa, Tokyo, JP;
Yuhei Horikawa, Tokyo, JP;
Yoshihiro Kanbayashi, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Hiroki Ashizawa, Tokyo, JP;
Miho Mori, Tokyo, JP;
Misaki Tamura, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); C23C 18/31 (2006.01); H05K 1/03 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); B32B 15/00 (2006.01); C23C 18/38 (2006.01); C23C 18/30 (2006.01); C23C 18/32 (2006.01);
U.S. Cl.
CPC ...
C23C 18/31 (2013.01); B32B 15/00 (2013.01); C23C 18/1603 (2013.01); C23C 18/1641 (2013.01); C23C 18/1651 (2013.01); C23C 18/1689 (2013.01); H05K 1/0373 (2013.01); H05K 3/06 (2013.01); H05K 3/181 (2013.01); H05K 999/99 (2013.01); C23C 18/30 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/072 (2013.01);
Abstract
A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.