The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Jul. 26, 2018
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Makoto Orikasa, Tokyo, JP;
Yuhei Horikawa, Tokyo, JP;
Yoshihiro Kanbayashi, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); C23C 18/32 (2006.01); C23C 18/38 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 3/30 (2006.01); H01L 23/52 (2006.01); H01L 27/15 (2006.01); B32B 27/18 (2006.01); C23C 18/30 (2006.01); H01L 23/498 (2006.01); C23F 1/02 (2006.01); H01L 33/62 (2010.01); H01L 23/14 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1641 (2013.01); B32B 3/30 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/36 (2013.01); C23C 18/161 (2013.01); C23C 18/1608 (2013.01); C23C 18/1651 (2013.01); C23C 18/30 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); H01L 23/52 (2013.01); H01L 27/156 (2013.01); B32B 2307/412 (2013.01); B32B 2457/20 (2013.01); C23F 1/02 (2013.01); H01L 23/145 (2013.01); H01L 23/498 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01);
Abstract
A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.