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For the Inventor, By the Inventor

Portland, OR, United States of America

Madhav Datta

This inventor holds 12 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2004-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Madhav Datta. Retrieved from https://idiyas.com/inventor/madhav-datta-jwv4ww8a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 75.0


Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 282(Granted Patents)


Company Filing History:

goldMedal12 out of 56,365 
 
Intel Corporation
 patents

Years Active: 2004-2018

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12 patents (USPTO):Explore Patents
1. 10037956 - Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same (2018-07-31),
2. 8952550 - Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same (2015-02-10),
3. 7250678 - Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same (2007-07-31),
4. 7196001 - Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same (2007-03-27),
5. 6977224 - Method of electroless introduction of interconnect structures (2005-12-20),
6. 6917106 - Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps (2005-07-12),
7. 6878465 - Under bump metallurgy for Lead-Tin bump over copper pad (2005-04-12),
8. 6853076 - Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same (2005-02-08),
9. 6750133 - Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps (2004-06-15),
10. 6740427 - Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same (2004-05-25),
11. 6703069 - Under bump metallurgy for lead-tin bump over copper pad (2004-03-09),
12. 6696758 - Interconnect structures and a method of electroless introduction of interconnect structures (2004-02-24),

Title: Innovations of Madhav Datta

Introduction

Madhav Datta is a prominent inventor based in Portland, OR (US). He has made significant contributions to the field of electrical devices, holding a total of 12 patents. His work focuses on enhancing the reliability of packaged structures through innovative metallurgy solutions.

Latest Patents

One of Madhav Datta's latest patents is the "Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same." This invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a titanium adhesion metal layer. The design of this stack is crucial as it resists tin migration toward the upper metallization of the device, thereby improving its reliability.

Career Highlights

Madhav Datta has built a successful career at Intel Corporation, where he has been instrumental in developing advanced technologies. His expertise in metallurgy and electrical engineering has led to numerous innovations that benefit the industry.

Collaborations

Throughout his career, Madhav has collaborated with notable colleagues, including Dave Emory and Subhash M Joshi. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Madhav Datta's contributions to the field of electrical devices through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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