The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2007

Filed:

Feb. 10, 2004
Applicants:

Madhav Datta, Portland, OR (US);

Dave Emory, Aloha, OR (US);

Subhash M. Joshi, Beaverton, OR (US);

Susanne Menezes, Portland, OR (US);

Doowon Suh, Warren, OR (US);

Inventors:

Madhav Datta, Portland, OR (US);

Dave Emory, Aloha, OR (US);

Subhash M. Joshi, Beaverton, OR (US);

Susanne Menezes, Portland, OR (US);

Doowon Suh, Warren, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.


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