Lung-Yuan Wang

This inventor holds 16 USPTO granted patents and 14 published patent applications, primarily in Semiconductor Packaging. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lung-Yuan Wang. Retrieved from https://idiyas.com/inventor/lung-yuan-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 16 (Patent Applications = 14)

% Patents Active = 100.0

Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 15(Granted Patents)

Company Filing History:

16 out of 826

Siliconware Precision Industries Co., Ltd.

patents

Years Active: 2016-2025

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Areas of Expertise:

Electronic Structure

Electronic Package

Fabrication Method

Assembly Substrate

Semiconductor Package

Manufacturing Method

Package on Package

Electronic Component

16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12438079 - Electronic structure (2025-10-07),

2. 12368116 - Electronic package and manufacturing method thereof (2025-07-22),

3. 12283560 - Electronic package including electronic structure and electronic body and manufacturing method thereof (2025-04-21),

4. 12114427 - Method for fabricating assemble substrate (2024-10-08),

5. 12009340 - Method for fabricating electronic package (2024-06-11),

6. 11984393 - Electronic package, manufacturing method for the same, and electronic structure (2024-05-14),

7. 11973047 - Electronic package including electronic structure and electronic component (2024-04-30),

8. 11382214 - Electronic package, assemble substrate, and method for fabricating the assemble substrate (2022-07-05),

9. 11152331 - Electronic package and method for fabricating the same (2021-10-19),

10. 10236261 - Electronic package and method for fabricating the same (2019-03-19),

11. 10163662 - Fabrication method of semiconductor package (2018-12-25),

12. 9905546 - Package on package structure and fabrication method thereof (2018-02-27),

13. 9646921 - Semiconductor package and fabrication method thereof (2017-05-09),

14. 9356008 - Semiconductor package and fabrication method thereof (2016-05-31),

15. 9343421 - Semiconductor package and fabrication method thereof (2016-05-17),

Title: Innovations of Lung-Yuan Wang

Introduction

Lung-Yuan Wang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 16 patents. His work focuses on enhancing the functionality and efficiency of electronic components through innovative designs.

Latest Patents

Among his latest patents is an electronic structure that serves as an integrated voltage regulator. This design incorporates a plurality of conductive pillars embedded in an encapsulating layer, facilitating electrical transmission with electronic components at a close range. Another notable patent is for an electronic package and its manufacturing method. This invention features an electronic element connected to multiple conductive vias and a functional part with a hollow area. The design allows for optoelectronic integration by enabling an optical fiber to connect to the external connection portion through the hollow area.

Career Highlights

Lung-Yuan Wang is currently associated with Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing electronic packaging technologies. His innovative approaches have garnered attention in the industry, contributing to the development of more efficient electronic systems.

Collaborations

He has collaborated with notable coworkers, including Feng Kao and Cheng-Chia Chiang. Their combined expertise has led to the successful development of various electronic packaging solutions.

Conclusion

Lung-Yuan Wang's contributions to electronic packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the advancement of technology in electronic systems.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

14 patents pending: