The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Apr. 20, 2017
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
An electronic package is provided, which includes: a substrate; an electronic component and a shielding member disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic component and the shielding member; and a metal layer formed on the encapsulant and electrically connected to the shielding member. A portion of a surface of the shielding member is exposed from a side surface of the encapsulant and in contact with the metal layer. As such, the width of the shielding member can be reduced so as to reduce the amount of solder paste used for bonding the shielding member to the substrate, thereby overcoming the conventional drawback of poor solder distribution. The present disclosure further provides a method for fabricating the electronic package.