The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Jun. 02, 2022
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Lung-Yuan Wang, Taichung, TW;
Wen-Liang Lien, Taichung, TW;
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H01L 23/3157 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/32 (2013.01); H05K 3/4682 (2013.01); H05K 1/0203 (2013.01); H05K 2201/042 (2013.01);
Abstract
A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members. The circuit members are spaced apart from one another in a current packaging process to increase a layer area. The assemble substrate thus fabricated meets the requirements for a packaging substrate of a large size, and has a high yield and low fabrication cost.