Wen-Liang Lien

Title: Innovations by Wen-Liang Lien

Introduction

Wen-Liang Lien is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on methods that enhance the efficiency and cost-effectiveness of fabricating assemble substrates.

Latest Patents

Wen-Liang Lien's latest patents include a method for fabricating an assemble substrate. This method involves stacking a circuit portion on multiple circuit members that are spaced apart during the packaging process. This innovative approach increases the layer area, allowing the fabricated assemble substrate to meet the requirements for large-sized packaging substrates while ensuring high yield and low fabrication costs. Another patent he holds is related to electronic packages and the method for fabricating the assemble substrate, which shares similar principles and benefits.

Career Highlights

Wen-Liang Lien is currently associated with Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing electronic packaging technologies. His innovative methods have contributed to the company's reputation for quality and efficiency in the industry.

Collaborations

Wen-Liang Lien collaborates with Lung-Yuan Wang, a talented woman in the field. Their partnership has fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Wen-Liang Lien's contributions to electronic packaging through his patents and work at Siliconware Precision Industries Co., Ltd. highlight his role as a key innovator in the industry. His methods not only improve fabrication processes but also pave the way for advancements in large-sized packaging substrates.