Shanghai, China

Liqiang Zhang

USPTO Granted Patents = 10 

Average Co-Inventor Count = 5.5

ph-index = 4

Forward Citations = 34(Granted Patents)


Company Filing History:


Years Active: 2018-2022

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10 patents (USPTO):

Title: Innovations of Liqiang Zhang in Thermal Interface Materials

Introduction

Liqiang Zhang is a prominent inventor based in Shanghai, China, known for his significant contributions to the field of thermal interface materials. With a total of 10 patents to his name, Zhang has made remarkable advancements that enhance the efficiency of heat transfer in electronic devices.

Latest Patents

Zhang's latest patents include a gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing. This innovative material is designed to effectively transfer heat from heat-generating electronic devices, such as computer chips, to heat dissipating structures like heat spreaders and heat sinks. The thermal interface material is characterized by its softness and elastic properties after curing, along with a high loading of thermally conductive fillers. It comprises various components, including long chain alkyl silicone oils, thermally conductive fillers, coupling agents, catalysts, crosslinkers, and addition inhibitors. Another notable patent is a gel-type thermal interface material that also focuses on enhancing heat transfer efficiency while minimizing oil leakage.

Career Highlights

Liqiang Zhang is currently employed at Honeywell International Inc., where he continues to innovate and develop advanced thermal interface materials. His work has been instrumental in improving the performance of electronic devices by ensuring efficient heat management.

Collaborations

Zhang collaborates with talented coworkers, including Ya Qun Liu and Ling Shen, who contribute to the research and development of cutting-edge technologies in the field.

Conclusion

Liqiang Zhang's contributions to thermal interface materials have significantly impacted the electronics industry. His innovative patents and ongoing work at Honeywell International Inc. demonstrate his commitment to advancing technology and improving heat transfer solutions.

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