The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Dec. 05, 2014
Applicant:
Honeywell International Inc., Morris Plains, NJ (US);
Inventors:
Liqiang Zhang, Shanghai, CN;
Ling Shen, Shanghai, CN;
Hui Wang, Shanghai, CN;
Ya Qun Liu, Shanghai, CN;
Wei Jun Wang, Shanghai, CN;
Hong Min Huang, Shanghai, CN;
Assignee:
Honeywell International Inc., Morris Plains, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); C09K 5/06 (2006.01); C09K 5/14 (2006.01);
U.S. Cl.
CPC ...
C09K 5/066 (2013.01); C09K 5/063 (2013.01); C09K 5/14 (2013.01); H01L 23/3737 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01);
Abstract
A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.