The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Feb. 04, 2015
Applicants:

Honeywell International Inc., Morristown, NJ (US);

Liang Zeng, Morristown, NJ (US);

Ya Qun Liu, Morristown, NJ (US);

Jerry Chang, Morristown, NJ (US);

Bright Zhang, Morristown, NJ (US);

Zhe Ding, Morristown, NJ (US);

Wei Jun Wang, Morristown, NJ (US);

Hong Min Huang, Morristown, NJ (US);

Inventors:

Liang Zeng, Shanghai, CN;

Ya Qun Liu, Shanghai, CN;

Wei Chang, Shanghai, CN;

Liqiang Zhang, Shanghai, CN;

Zhe Ding, Shanghai, CN;

Wei Jun Wang, Shanghai, CN;

Hong Min Huang, Shanghai, CN;

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); C09K 5/06 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); C09K 5/063 (2013.01); H01L 23/367 (2013.01); H01L 23/42 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.


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