The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Oct. 15, 2018
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Ling Shen, Shanghai, CN;

Kai Zhang, Shanghai, CN;

Liqiang Zhang, Shanghai, CN;

Ya Qun Liu, Shanghai, CN;

Huifeng Duan, Shanghai, CN;

Haigang Kang, Shanghai, CN;

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/34 (2006.01); H01L 23/373 (2006.01); C08K 3/00 (2018.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C09K 5/10 (2006.01); C09K 5/14 (2006.01); F28F 13/00 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
C09K 5/10 (2013.01); F28F 13/00 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H05K 1/0203 (2013.01); F28F 2013/006 (2013.01); H01L 23/373 (2013.01); H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/32245 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01);
Abstract

The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.


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