The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Jul. 05, 2017
Applicant:
Honeywell International Inc., Morris Plains, NJ (US);
Inventors:
Liqiang Zhang, Shanghai, CN;
Huifeng Duan, Shanghai, CN;
Kai Zhang, Shanghai, CN;
Ya Qun Liu, Shanghai, CN;
Ling Shen, Shanghai, CN;
Wei Jun Wang, Shanghai, CN;
Haigang Kang, Shanghai, CN;
Assignee:
Honeywell International Inc., Morris Plains, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08K 3/22 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/22 (2013.01); H05K 7/2039 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/001 (2013.01); C08K 2201/014 (2013.01);
Abstract
A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.