The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Apr. 09, 2020
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Kai Zhang, Shanghai, CN;

Liqiang Zhang, Shanghai, CN;

Ling Shen, Shanghai, CN;

Ya Qun Liu, Shanghai, CN;

Assignee:

Honeywell International Inc., Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); H01L 23/36 (2006.01); C08G 77/20 (2006.01); C08K 3/22 (2006.01); C08G 77/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); C08G 77/16 (2013.01); C08G 77/20 (2013.01); C08K 3/22 (2013.01); C08L 83/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01);
Abstract

The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material is soft and has elastic properties post-curing along with high thermally conductive filler loading. The thermal interface material includes at least one long chain alkyl silicone oil; at least one long chain, vinyl terminated alkyl silicone oil; at least one long chain, single end hydroxyl terminated silicone oil; at least one thermally conductive filler, at least one coupling agent, at least one catalyst, at least one crosslinker, and at least one addition inhibitor.


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