Company Filing History:
Years Active: 2016-2020
Title: Innovations by Laura Mauer
Introduction
Laura Mauer is a prominent inventor based in South Kent, Connecticut. She has made significant contributions to the field of semiconductor processing, holding a total of 10 patents. Her work focuses on advanced etching methods that enhance the efficiency and precision of wafer processing.
Latest Patents
One of her latest patents is titled "Two etch method for achieving a wafer thickness profile." This invention discloses a system and method for performing a wet etching process. The system includes multiple processing stations accessible by a transfer device, including a measuring station to optically measure the thickness of a wafer before and after each etching step in the process. The system also features a controller that analyzes the thickness measurements in view of a target wafer profile and generates an etch recipe dynamically and in real time for each etching step. Additionally, the process controller can cause a single wafer wet etching station to etch the wafer according to the generated etching recipes. Based on the pre and post-etch thickness measurements and target etch profile, the system can generate and refine the etch recipes.
Another notable patent is the "Apparatus and method for wafer thinning in advanced packaging applications." This invention provides a system and method for etching semiconductor wafers with advanced packaging using a two-step wet etching process. The first etch step employs an etchant that is non-selective to at least the wafer material (silicon) and metals, such as copper and titanium, present in the wafer. The second etch step utilizes an etchant that is selective to the wafer material (silicon) and has low selectivity for the metals, thereby leaving them substantially intact.
Career Highlights
Laura Mauer is currently employed at Veeco Precision Surface Processing LLC, where she continues to innovate in the field of semiconductor processing. Her expertise and contributions have positioned her as a key figure in the industry.
Collaborations
She has collaborated with notable colleagues, including John Taddei and John Clark, who have also contributed to advancements in semiconductor technologies.
Conclusion
Laura Mauer's innovative work in semiconductor processing has led to significant advancements in wafer etching techniques. Her patents reflect her commitment to improving the efficiency and precision of semiconductor manufacturing processes.