The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Nov. 03, 2014
Veeco Precision Surface Processing Llc, Horsham, PA (US);
William Gilbert Breingan, Media, PA (US);
Lev Rapoport, Yardley, PA (US);
John Clark, Philadelphia, PA (US);
John Taddei, Breinigsville, PA (US);
Laura Mauer, South Kent, CT (US);
VEECO PRECISION SURFACE PROCESSING LLC, Horsham, PA (US);
Abstract
The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion.