The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Jun. 20, 2013
Apparatus and method for removing challenging polymer films and structures from semiconductor wafers
Veeco Precision Surface Processing Llc, Horsham, PA (US);
John Taddei, Breinigsville, PA (US);
Laura Mauer, South Kent, CT (US);
Ramey Youssef, Horsham, PA (US);
John Clark, Philadelphia, PA (US);
Elena Lawrence, East Norriton, PA (US);
VEECO PRECISION SURFACE PROCESSING LLC, Horsham, PA (US);
Abstract
The present apparatus and method are configured to remove challenging polymer films and structures from semiconductor wafers. This technique involves the use of a double soak and spray sequence with unique parameters and can be varied depending upon the application. The initial immersion step is used to initiate the swelling and dissolution of the polymer. The first spray step may include a high pressure needle to pierce through the top layer allowing more solvent to penetrate in the subsequent soak process. The second immersion can then penetrate further and faster allowing substantial penetration of the polymer by the solvent. The final high pressure spray proceeds to remove all of the polymer coating. The process ends with a final rinse and dry sequence.