The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Oct. 30, 2015
Applicant:

Veeco Precision Surface Processing Llc, Horsham, PA (US);

Inventors:

Laura Mauer, South Kent, CT (US);

John Taddei, Jim Thorpe, PA (US);

John Clark, Philadelphia, PA (US);

Elena Lawrence, East Norriton, PA (US);

Eric Kurt Zwirnmann, Horsham, PA (US);

David A. Goldberg, Horsham, PA (US);

Jonathan Yutkowitz, Horsham, PA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/306 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/02057 (2013.01); H01L 21/30604 (2013.01); H01L 21/30608 (2013.01); H01L 21/6708 (2013.01); H01L 21/67046 (2013.01); H01L 21/76898 (2013.01); H01L 22/20 (2013.01);
Abstract

A system and method for performing a wet etching process is disclosed. The system includes multiple processing stations accessible by a transfer device, including a measuring station to optically measure the thickness of a wafer before and after each etching steps in the process. The system also includes a controller to analyze the thickness measurements in view of a target wafer profile and generate an etch recipe, dynamically and in real time, for each etching step. In addition, the process controller can cause a single wafer wet etching station to etch the wafer according to the generated etching recipes. In addition, the system can, based on the pre and post-etch thickness measurements and target etch profile, generate and/or refine the etch recipes.


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