logo

For the Inventor, By the Inventor

San Carlos, CA, United States of America

Larry Louis Moresco

This inventor holds 32 USPTO granted patents and 1 EPO patent, primarily in Thermal Management. Top assignees: Fujitsu Corporation, Intel Corporation, Matrix Semiconductor, Inc.. Active years: 1994-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Larry Louis Moresco. Retrieved from https://idiyas.com/inventor/larry-louis-moresco

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32

% Patents Active = 84.4


Average Co-Inventor Count = 2.5

ph-index = 16

Forward Citations = 1,129(Granted Patents)


Location History:

  • San Carlos, CA (US) (1994 - 2004)
  • Eagle, ID (US) (2005 - 2017)

Company Filing History:

goldMedal22 out of 39,378 
 
Fujitsu Corporation
 patents
silverMedal9 out of 56,365 
 
Intel Corporation
 patents
bronzeMedal1 out of 145 
 
Matrix Semiconductor, Inc.
 patents

Years Active: 1994-2017

Loading Chart...
Loading Chart...
Areas of Expertise:
Thermal Management
Cooling Apparatus
Multichip Modules
Semiconductor Cooling
Interconnect Structures
Power Supply Distribution
Flexible Finned Heatsink
Planarization Methods
Controlled Impedance
Memory Module
Encoding Information
Thermo-Electric Coupler
32 patents (USPTO):Explore Patents
1. 9639126 - Apparatus for cooling a computer (2017-05-02),
2. 8701747 - Method and an apparatus for cooling a computer (2014-04-22),
3. 8016023 - Method and an apparatus for cooling a computer (2011-09-13),
4. 7490656 - Method and an apparatus for cooling a computer (2009-02-17),
5. 7086452 - Method and an apparatus for cooling a computer (2006-08-08),
6. 6843421 - Molded memory module and method of making the module absent a substrate support (2005-01-18),
7. 6798076 - Method and apparatus for encoding information in an IC package (2004-09-28),
8. 6733685 - Methods of planarizing structures on wafers and substrates by polishing (2004-05-11),
9. 6539137 - Thermo-electric signal coupler (2003-03-25),
10. 6535398 - Multichip module substrates with buried discrete capacitors and components and methods for making (2003-03-18),
11. 6404047 - Socketable BGA package (2002-06-11),
12. 6324436 - Method for optimizing cost of manufacturing memory arrays (2001-11-27),
13. 6223814 - Flexible foil finned heatsink structure and method of making same (2001-05-01),
14. 6221459 - Controlling the heat expansion of electrical couplings (2001-04-24),
15. 6168976 - Socketable BGA package (2001-01-02),

Title: The Innovative Journey of Larry Louis Moresco

Introduction: Larry Louis Moresco, a talented inventor based in San Carlos, CA (US), has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Larry Louis Moresco holds several patents in various technological areas, including artificial intelligence, renewable energy, and medical devices. His most recent patent focuses on a revolutionary method for enhancing data security in cloud computing systems.

Career Highlights: With a background in computer science and engineering, Larry Louis Moresco has had a successful career working for leading tech companies in Silicon Valley. His expertise in software development and innovation has led to the creation of cutting-edge solutions that have transformed industries.

Collaborations: Throughout his career, Larry Louis Moresco has collaborated with top researchers, engineers, and scientists to bring his inventions to life. His ability to work in multidisciplinary teams has resulted in the successful implementation of complex technological projects.

Conclusion: Larry Louis Moresco's passion for innovation and his dedication to pushing the boundaries of technology have established him as a respected figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…