The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Mar. 07, 2000
Larry L. Moresco, San Carlos, CA (US);
Fujitsu Limited, Kawasaki, JP;
Abstract
Modularly constructed multichip modules with are disclosed. A plurality of miniature capacitor substrates and/or miniature resistor substrates are assembled and attached to a base substrate, preferably in a regular pattern. Power supply substrates are preferably attached to the base substrate along with the miniature substrates. All of the attached components are preferably pretested and have thicknesses close to one another. The pretesting substantially increases the manufacturing yield. Gaps between the miniature substrates and power supply substrates are filled with a polymer material, such as a powder-filled polyimide precursor. Thereafter, dielectric layer is formed over the components to provide a more planar surface. The dielectric layer is preferably planarized, such as by a chemical mechanical polishing process, to provide for a more planar layer. Thereafter, a plurality of interleaving metal and dielectric layers are formed over the assembled components to provide power distribution planes and signal lines.