Fujitsu Corporation

Intel Corporation

Matrix Semiconductor, Inc.

Larry Louis Moresco

Solomon I Beilin

Wen-chou Vincent Wang

David A Horine

William T Chou

Michael G Lee

David G Love

Borys S Senyk

David Kudzuma

Vivek Mansingh

Richard L Wheeler

Teruo Murase

Connie M Wong

Michael G Peters

James J Roman

Kevin J Haley

Som S Swamy

John William Horigan

Kristopher J Frutschy

Gregory Alan James

Khushrav S Chhor

Patricia R Boucher

An apparatus including a tube to encase a fluid, a first portion of the tube disposed in a base portion of a mobile computing device, a second portion of the tube disposed in a display portion of the mobile computing device, the second portion of the tube including metal and a pump coupled to the tube and operable to circulate the fluid in the tube. A mobile computing device including a base portion; a display portion; a tube to encase a fluid, a first portion of the tube disposed in the base portion, a second portion of the tube disposed in the display portion and including metal, the base portion and the display portion coupled by a hinge; and a pump coupled to the tube and operable to circulate the fluid in the tube.

Apparatus for cooling a computer

A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.

Method and an apparatus for cooling a computer

A method including sensing a temperature of an electronic component in a portable computing device; circulating a fluid between one of a first heat transfer plate and a second heat transfer plate in response to a threshold temperature being sensed; and stopping the circulating in response to sensing a temperature is below the threshold temperature. A heat exchanging system including a first heat transfer plate coupled to an electronic component and to a second heat transfer plate; and a fluid for circulating through one of the first heat transfer plate and the second heat transfer plate in response to a threshold temperature being sensed by a sensor. An apparatus including a heat generating element; a first heat transfer plate coupled to the heat generating element; a second heat transfer plate; and a fluid for circulating through a tube, the first part and the second part of the portable computing device in response to a threshold temperature being sensed by a sensor.

A heat exchanging system that includes a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device, where the system includes a pump coupled to the tube, and a temperature sensor coupled to the tube and the pump.

An improved memory module and method of manufacture are presented. The memory module takes on the same outer dimensions as conventional memory cards. The memory module includes an integrated circuit and a conductor encased within molded resin. The conductor can be taken from a tape or a lead frame, and can include bumps or wires extending from the conductor to corresponding bonding pads on the integrated circuit. The bonded integrated circuit can thereafter be placed within a cavity formed inside a mold housing, where resin may be injected to form the memory module. The conductor can also be shaped so as to extend on multiple planes from the connection point on or near the bonding pad to an edge connector residing near one edge only of the memory module. The conductor is thereby connected to the integrated circuit and provides slide-in, releasable coupling to a receptor.

Molded memory module and method of making the module absent a substrate support

An integrated circuit (IC) package includes a substrate, a ground line, and an encoded region. The encoded region provides information based upon selective deposition of solder balls electrically coupled to the ground line.

Method and apparatus for encoding information in an IC package

Methods of planarizing structures formed on the surfaces of substrates and wafers are disclosed. The methods form a planarizing layer over the surface and the structures, or the locations where the structures are to be formed, such that the top surface of the layer has low areas between the locations of the structures, and such that the low areas lie substantially within a plane which is below the tops of the structures. A polish-stop layer is thee formed over the low areas of the planarizing layer, the polish-stop layer being more resistant to polishing than the planarizing layer and, preferably, the structures. The resulting surface is then polished. The polishing may be accomplished by, for example, standard mechanical polishing, and chemical-mechanical polishing.

Methods of planarizing structures on wafers and substrates by polishing

A signal coupler is comprised of a transmitting section and a receiving section. The receiving section includes a polymer pyroelectric film element having a greater than 1% by volume of a high thermal diffusivity material, such as aluminum nitride, to improve the thermal diffusivity of the polymer film. A preferred embodiment of the transmitting section includes a thin film resistive heater to generate thermal pulses which are coupled to the receiving section by a thin film of thermal grease disposed between the receiving section and the transmitting section.

Thermo-electric signal coupler

Modularly constructed multichip modules with are disclosed. A plurality of miniature capacitor substrates and/or miniature resistor substrates are assembled and attached to a base substrate, preferably in a regular pattern. Power supply substrates are preferably attached to the base substrate along with the miniature substrates. All of the attached components are preferably pretested and have thicknesses close to one another. The pretesting substantially increases the manufacturing yield. Gaps between the miniature substrates and power supply substrates are filled with a polymer material, such as a powder-filled polyimide precursor. Thereafter, dielectric layer is formed over the components to provide a more planar surface. The dielectric layer is preferably planarized, such as by a chemical mechanical polishing process, to provide for a more planar layer. Thereafter, a plurality of interleaving metal and dielectric layers are formed over the assembled components to provide power distribution planes and signal lines.

Multichip module substrates with buried discrete capacitors and components and methods for making

Socketable balls are mounted to a BGA package by first placing the balls into pockets or holes of a tray that are sized such that when the balls are inserted, an upper portion of the ball protrudes above a planar surface of the tray. A layer of a polymer material is then applied over the balls and a top area of each of the balls is exposed, and plated with solder. During the plating step the polymer provides a solder-tight seal against each of the balls such that, except for the top area, the rest of the surface area of the balls remains solder-free. The solder-plated top area of each of the balls is then bonded to the corresponding plurality of lands of the package by reflowing the solder to establish electrical contact therebetween.

Socketable BGA package

A method of determining the most cost effective manner in which to provide a given number of memory or logic gates for a particular application. The method takes into consideration both the cost per memory bit of fabricating memory cells on a semiconductor chip as a function of the number of memory cells on the chip (i.e, the chip size), and the costs of assembling multiple memory chips into a larger memory device using different assembly and packaging configurations. By considering the fabrication and packaging costs together, the most economically efficient combination of memory chip size and packaging method to produce a desired memory capacity can be determined.

Method for optimizing cost of manufacturing memory arrays

Heatsink structures for integrated circuit chips, chip packages, printed wiring boards and the like are disclosed. The heatsink structures according to the present invention have thin flexible cooling fins which move and vibrate under the flow of a cooling fluid. In one embodiment, the fins comprise a thin metal film, such as copper or aluminum, which is laminated to a thin polymeric layer. The polymeric layer provides resilience and elasticity to the metal film and the cooling fins.

Flexible foil finned heatsink structure and method of making same

A coupling such as a socket may couple one electronic device to another and may reduce differential thermal expansion between the two coupled devices. For example, a surface mount socket may differentially expand relative to a printed circuit board. By incorporating a structure having a coefficient of thermal expansion that matches the coefficient of thermal expansion of the printed circuit board, differential thermal expansion may be lessened and the possibility of mechanical damage may be reduced.

Growing community of inventors

San Carlos, CA, United States of America

Larry Louis Moresco