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Yongin-si, South Korea

Kwan-Jai Lee

USPTO Granted Patents = 8 (Patent Applications = 2)

Average Co-Inventor Count = 4.6

ph-index = 4

Forward Citations = 375(Granted Patents)

Location History:

Chungcheongnam-do, KR (2002 - 2007)
Cheonan-si, KR (2008)
Yongin-si, KR (2014 - 2016)

Company Filing History:

8 out of 131,214

Samsung Electronics Co., Ltd.

Years Active: 2002-2016

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9280182 - Chip on film package and display device including the same (2016-03-08),

2. 9059162 - Chip on film (COF) substrate, COF package and display device including the same (2015-06-16),

3. 8853694 - Chip on film package including test pads and semiconductor devices including the same (2014-10-07),

4. 8803301 - Semiconductor package (2014-08-12),

5. 8629547 - Semiconductor chip package (2014-01-14),

6. 7339262 - Tape circuit substrate and semiconductor apparatus employing the same (2008-03-04),

7. 7247936 - Tape circuit substrate having wavy beam leads and semiconductor chip package using the same (2007-07-24),

8. 6448661 - Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof (2002-09-10),

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