The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Mar. 22, 2012
Kyong-soon Cho, Goyang-si, KR;
Seung-kon Mok, Suwon-si, KR;
Kwan-jai Lee, Yongin-si, KR;
Jae-min Jung, Seoul, KR;
Kyong-soon Cho, Goyang-si, KR;
Seung-kon Mok, Suwon-si, KR;
Kwan-jai Lee, Yongin-si, KR;
Jae-min Jung, Seoul, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package may include a substrate, a semiconductor chip disposed on the substrate, a communication terminal and a static electricity inducing terminal connected to a ground. The package may include a first sealant that comprises a voltage sensitive material and that covers the semiconductor chip and a static electricity blocking layer that provides a conductive pathway from the first sealant to only the static electric inducing terminal. The static electricity blocking layer may prevent the communication terminal from being electrically connected to the first sealant. If a buildup of charge is applied to the device, the first sealant may become polarized and/or conductive. The extra voltage may travel through the first sealant to the static electricity inducing terminal via an opening in the static electricity blocking layer. The semiconductor chip and the communication terminal may not be affected by the extra charge.