The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2014
Filed:
Jul. 13, 2011
Kyong-soon Cho, Goyang-si, KR;
Chang-su Kim, Hwaseong-si, KR;
Kwan-jai Lee, Yongin-si, KR;
Kyoung-sei Choi, Yongin-si, KR;
Jae-hyok Ko, Hwaseong-si, KR;
Keung-beum Kim, Suwon-si, KR;
Kyong-Soon Cho, Goyang-si, KR;
Chang-Su Kim, Hwaseong-si, KR;
Kwan-Jai Lee, Yongin-si, KR;
Kyoung-Sei Choi, Yongin-si, KR;
Jae-Hyok Ko, Hwaseong-si, KR;
Keung-Beum Kim, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A structure of a semiconductor chip package is provided. The semiconductor chip package includes: a substrate; a semiconductor chip mounted on a first surface of the substrate; a plurality of electrode pads on a second surface, different from the first surface, of the substrate; and an electrostatic discharge protection pad overlapping a portion of a first electrode pad and a portion of a second electrode pad among the plurality of electrode pads.