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For the Inventor, By the Inventor

Richardson, TX, United States of America

Kurt Peter Wachtler

USPTO Granted Patents = 38 

 

Average Co-Inventor Count = 2.3

ph-index = 9

Forward Citations = 671(Granted Patents)


Location History:

  • Richardson, CA (US) (2003)
  • Richardson, TX (US) (1997 - 2022)

Company Filing History:

goldMedal38 out of 29,232 
 
Texas Instruments Corporation
 patents
silverMedal1 out of 1,009 
 
Amkor Technology, Inc.
 patents
where one patent can have more than one assignee

Years Active: 1997-2024

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38 patents (USPTO):
1. 12176298 - Floating die package (2024-12-24),
2. 11538767 - Integrated circuit package with partitioning based on environmental sensitivity (2022-12-27),
3. 11538717 - Electronic package for integrated circuits and related methods (2022-12-27),
4. 11498831 - Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip (2022-11-15),
5. 11387782 - Stacked-die bulk acoustic wave oscillator package (2022-07-12),
6. 10892712 - Stacked-die bulk acoustic wave oscillator package (2021-01-12),
7. 10861796 - Floating die package (2020-12-08),
8. 10861741 - Electronic package for integrated circuits and related methods (2020-12-08),
9. 10723616 - Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip (2020-07-28),
10. 10574184 - Stacked-die bulk acoustic wave oscillator package (2020-02-25),
11. 10544039 - Methods for depositing a measured amount of a species in a sealed cavity (2020-01-28),
12. 10233074 - Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip (2019-03-19),
13. 9896330 - Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip (2018-02-20),
14. 9312253 - Heterogeneous integration of memory and split-architecture processor (2016-04-12),
15. 8957525 - 3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor (2015-02-17),

Title: Kurt Peter Wachtler: Innovator in Integrated Circuit Technology

Introduction: Kurt Peter Wachtler is a prominent inventor located in Richardson, Texas, known for his significant contributions to the field of integrated circuit technology. With an impressive record of 38 patents, he has developed innovative solutions that address challenges in electronic packaging and circuit design.

Latest Patents: Among his latest patents is the "Floating Die Package," which introduces a novel design that includes a cavity formed through sublimation of a sacrificial die encapsulant. This innovation allows for the separation of die attach materials after the molding assembly, creating a unique environment where the die or die stack is suspended by bond wires within the cavity. Additionally, he holds a patent for an "Integrated Circuit Package with Partitioning Based on Environmental Sensitivity." This integrated circuit design features a lead frame connected to a first die and a second die, which is electrically separated from the first, thereby enhancing operational reliability under varying environmental conditions.

Career Highlights: Throughout his career, Kurt has made substantial contributions while working at major technology companies such as Texas Instruments Corporation and Amkor Technology, Inc. His work reflects a commitment to advancing electronic component design and functionality.

Collaborations: Wachtler has collaborated with notable coworkers in the industry, including Benjamin Stassen Cook and Mark Allen Gerber. These partnerships have enhanced the innovation process, helping to bring cutting-edge technologies to fruition.

Conclusion: Kurt Peter Wachtler's extensive patent portfolio and collaborative efforts highlight his role as a leading inventor in the field of integrated circuits. His latest innovations not only demonstrate technical prowess but also contribute to the ongoing evolution of electronic packaging solutions.

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