The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Jan. 06, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Ricky A. Jackson, Richardson, TX (US);

Kurt Peter Wachtler, Richardson, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/32 (2006.01); H03H 9/17 (2006.01); H01L 41/25 (2013.01); H03H 9/05 (2006.01); H01L 23/00 (2006.01); H01L 41/047 (2006.01); H01L 23/495 (2006.01); H01L 41/053 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H03B 5/326 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 24/94 (2013.01); H01L 25/16 (2013.01); H01L 41/0475 (2013.01); H01L 41/0533 (2013.01); H01L 41/25 (2013.01); H03H 9/0523 (2013.01); H03H 9/0547 (2013.01); H03H 9/175 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/14 (2013.01);
Abstract

A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.


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