The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Dec. 08, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Kurt Peter Wachtler, Richardson, TX (US);
Anindya Poddar, Sunnyvale, CA (US);
Usman Mahmood Chaudhry, McKinney, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); B81B 7/00 (2006.01); H01L 23/31 (2006.01); H01L 21/822 (2006.01); H01L 23/00 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); B81B 7/007 (2013.01); H01L 21/822 (2013.01); H01L 23/04 (2013.01); H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/4985 (2013.01); H01L 24/80 (2013.01); H05K 1/185 (2013.01); H01L 23/3107 (2013.01); H01L 23/562 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/06524 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/351 (2013.01); H01L 2924/35121 (2013.01);
Abstract
Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.