The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Jul. 28, 2020
Texas Instruments Incorporated, Dallas, TX (US);
Kurt Peter Wachtler, Richardson, TX (US);
Makoto Yoshino, Beppu Oita-Ken, JP;
Ayumu Kuroda, Beppu Oita-Ken, JP;
Brian E. Goodlin, Plano, TX (US);
Karen Kirmse, Richardson, TX (US);
Benjamin Cook, Rockwall, TX (US);
Genki Yano, Beppu Oita-Ken, JP;
Stuart Jacobsen, Frisco, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A packaged micro-electro-mechanical system (MEMS) device () comprises a circuitry chip () attached to the pad () of a substrate with leads (), and a MEMS () vertically attached to the chip surface by a layer () of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring () with a surface phobic to silicone compounds. A dome-shaped glob () of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package () of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.