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For the Inventor, By the Inventor

Beppu, Japan

Genki Yano

This inventor holds 14 USPTO granted patents and 5 published patent applications and 1 EPO patent. Top assignee: Texas Instruments Corporation. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Genki Yano. Retrieved from https://idiyas.com/inventor/genki-yano

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 32(Granted Patents)


Location History:

  • Beppu Oita-Ken, JP (2018 - 2022)
  • Oita, JP (2022)
  • Beppu, JP (2016 - 2023)

Company Filing History:

goldMedal14 out of 29,869 
 
Texas Instruments Corporation
 patents

Years Active: 2016-2025

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14 patents (USPTO):Explore Patents
1. 12198982 - Laser dicing for singulation (2025-01-14),
2. 11664276 - Front side laser-based wafer dicing (2023-05-30),
3. 11498831 - Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip (2022-11-15),
4. 11482442 - Subring for semiconductor dies (2022-10-25),
5. 11469141 - Laser dicing for singulation (2022-10-11),
6. 11367699 - Integrated circuit backside metallization (2022-06-21),
7. 11171031 - Die matrix expander with partitioned subring (2021-11-09),
8. 10763230 - Integrated circuit backside metallization (2020-09-01),
9. 10723616 - Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip (2020-07-28),
10. 10658240 - Semiconductor die singulation (2020-05-19),
11. 10233074 - Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip (2019-03-19),
12. 9896330 - Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip (2018-02-20),
13. 9543206 - Wafer die separation (2017-01-10),
14. 9230862 - Wafer die separation (2016-01-05),

Title: The Innovative Journey of Genki Yano

Introduction: Genki Yano, a talented inventor hailing from Beppu, Japan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Genki Yano's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar-powered devices for sustainable living.

Career Highlights: With a career spanning over two decades, Genki Yano has established himself as a leading figure in the tech industry, with a strong focus on environmental sustainability and clean energy solutions.

Collaborations: Throughout his career, Genki Yano has collaborated with top research institutions and universities to further his research and bring his innovative ideas to life. His partnerships have led to the successful implementation of cutting-edge technologies in various sectors.

Conclusion: Genki Yano's passion for innovation and commitment to creating a more sustainable future have solidified his position as a respected inventor in the global tech community. His work continues to inspire and drive positive change in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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