The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
May. 14, 2013
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventor:
Genki Yano, Beppu, JP;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/6836 (2013.01); H01L 21/67 (2013.01); H01L 21/683 (2013.01); H01L 21/6835 (2013.01); H01L 21/68721 (2013.01); H01L 21/68735 (2013.01); H01L 2221/68336 (2013.01);
Abstract
A method of separating dice of a singulated wafer that is supported on a dicing tape sheet is disclosed. The method may include attaching the dicing tape sheet to a ring frame; relatively raising a portion of the dicing tape sheet supporting the wafer with respect to the ring frame; and attaching support tape to the ring frame and the dicing tape sheet.
Yano, Genki. (2016). Wafer die separation (U.S. Patent No. 9230862). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9230862
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile