Tainan, Taiwan

Kun-Wei Lin


Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 29(Granted Patents)


Location History:

  • Hsinchu Hsien, TW (1998)
  • Tou-Liu, TW (2005)
  • Tainan County, TW (2010 - 2012)
  • Tainan, TW (2002 - 2015)

Company Filing History:


Years Active: 1998-2015

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8 patents (USPTO):Explore Patents

Title: Innovations by Inventor Kun-Wei Lin

Introduction

Kun-Wei Lin is an accomplished inventor based in Tainan, Taiwan, holding a total of eight patents. His contributions to the field of flexible electronics have garnered considerable attention due to their innovative approaches and practical applications.

Latest Patents

Among his most recent inventions is a flexible base material and a flexible electronic device. This invention features a flexible substrate with a unique structure that optimizes its durability and functionality. The flexible substrate has two opposing surfaces, on which a first organic composite barrier layer is deposited on the first surface, applying a first stress to the substrate. An anti-curved layer placed on the second surface counteracts this stress, effectively cancelling more than 90% of the first stress.

Another significant patent granted to Kun-Wei Lin details a compound barrier layer, which includes a strategically layered configuration of materials. This compound barrier layer consists of a first barrier layer placed on a substrate, and a second barrier layer atop the first, utilizing alternately arranged inorganic material regions and organo-silicon material regions to enhance performance and reliability in electronic applications.

Career Highlights

Kun-Wei Lin has made major strides in his career by working with prominent institutions such as the Industrial Technology Research Institute (ITRI) and the National Science Council of Taiwan. His role in these organizations has allowed him to contribute significantly to the advancement of technology and innovation in flexible electronics.

Collaborations

Throughout his career, he has collaborated with notable coworkers, including Wen-Chau Liu and Chun-Ting Chen. These professional partnerships have fostered an environment of creativity and innovation, leading to advancements in technology and new product developments.

Conclusion

Kun-Wei Lin continues to make an impact in the fields of flexible electronics and materials science through his innovative patents and collaborations. His work is characterized by a commitment to developing solutions that enhance the functionality and versatility of electronic devices, paving the way for future advancements in technology.

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