The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Dec. 27, 2011
Applicants:

Li-wen Lai, Taichung, TW;

Kun-wei Lin, Tainan, TW;

Chun-ting Chen, Taoyuan County, TW;

Chun-hao Chang, Tainan, TW;

Inventors:

Li-Wen Lai, Taichung, TW;

Kun-Wei Lin, Tainan, TW;

Chun-Ting Chen, Taoyuan County, TW;

Chun-Hao Chang, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H05K 1/0271 (2013.01); H05K 1/185 (2013.01); H05K 2201/0162 (2013.01); H05K 1/0393 (2013.01); H05K 2201/10106 (2013.01); H01L 51/0097 (2013.01); H01L 51/5253 (2013.01); Y02E 10/549 (2013.01);
Abstract

The invention provides a flexible base material and a flexible electronic device. The flexible base material includes a flexible substrate having a first surface and a second surface opposite to the first surface. A first organic composite barrier layer is deposited on the first surface of the flexible substrate, wherein the first organic composite barrier layer applies a first stress to the flexible substrate. An anti-curved layer is deposited on the second surface of the flexible substrate, wherein the anti-curved layer applies a second stress to the flexible substrate, and wherein the second stress applied by the anti-curved layer cancels off more than 90% of the first stress.


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