logo

For the Inventor, By the Inventor

Wappingers Falls, NY, United States of America

Koushik Ramachandran

This inventor holds 14 USPTO granted patents and 3 published patent applications. Top assignees: Globalfoundries U.S. Inc., Globalfoundries Inc.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koushik Ramachandran. Retrieved from https://idiyas.com/inventor/koushik-ramachandran

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 78.6

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 35(Granted Patents)


Location History:

  • Wappigners Falls, NY (US) (2019)
  • Wappingers Falls, NY (US) (2019 - 2023)

Company Filing History:

goldMedal11 out of 1,087 
 
Globalfoundries U.S. Inc.
 patents
silverMedal3 out of 5,671 
 
Globalfoundries Inc.
 patents

Years Active: 2019-2026

Loading Chart...
14 patents (USPTO):Explore Patents
1. 12683354 - Laser chips attached to a photonics chip by multiple anchors (2026-07-14),
2. 12665384 - Laser chips attached to a photonics chip by multiple adhesives (2026-06-23),
3. 12663593 - Structures for a photonics chip that enable external communication (2026-06-23),
4. 12529852 - Photonic structures including multiple input/output optical couplers (2026-01-20),
5. 12339494 - Edge couplers with a fine-alignment mechanism (2025-06-24),
6. 12135456 - Waveguide cores with a dual-trapezoidal shape (2024-11-05),
7. 11828983 - Photonics chips including cavities with non-right-angle internal corners (2023-11-28),
8. 11804452 - Pic structure having barrier surrounding opening for optical element to prevent stress damage (2023-10-31),
9. 11502400 - Microelectronics package with ultra-low-K dielectric region between stacked antenna elements (2022-11-15),
10. 11502106 - Multi-layered substrates of semiconductor devices (2022-11-15),
11. 11075453 - Microelectronics package with ultra-low-K dielectric region between stacked antenna elements (2021-07-27),
12. 10598860 - Photonic die fan out package with edge fiber coupling interface and related methods (2020-03-24),
13. 10438894 - Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices (2019-10-08),
14. 10409014 - PIC die packaging using magnetics to position optical element (2019-09-10),

Title: The Innovative Journey of Koushik Ramachandran

Introduction:

Koushik Ramachandran, a talented inventor hailing from Wappingers Falls, NY, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents:

Koushik Ramachandran's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles and smart home systems, showcasing his commitment to revolutionizing everyday life through technology.

Career Highlights:

With over two decades of experience in the tech industry, Koushik Ramachandran has held key roles in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful products and solutions.

Collaborations:

Throughout his career, Koushik Ramachandran has collaborated with top researchers, engineers, and designers from renowned universities and research institutions worldwide, fostering a culture of innovation and excellence in all his projects.

Conclusion:

In conclusion, Koushik Ramachandran's passion for innovation and his relentless drive to push the boundaries of technology make him a true pioneer in the field of inventions, with a lasting impact on the industry and society as a whole.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…