The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Jul. 30, 2021
Applicant:

Globalfoundries Us Inc., Malta, NY (US);

Inventors:

Nicholas A Polomoff, Hopewell Junction, NY (US);

Jae Kyu Cho, Niskayuna, NY (US);

Mohamed Rabie, Clifton Park, NY (US);

Yunyao Jiang, Mechanicville, NY (US);

Koushik Ramachandran, Wappingers Falls, NY (US);

Pallabi Das, Bangalore, IN;

Assignee:

GLOBALFOUNDRIES U.S. Inc., Malta, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/10 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); G02B 6/30 (2006.01); G02B 6/125 (2006.01); G02B 6/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); G02B 6/12004 (2013.01); G02B 6/125 (2013.01); G02B 6/13 (2013.01); G02B 6/30 (2013.01); H01L 23/585 (2013.01);
Abstract

A photonic integrated circuit (PIC) structure includes an active region in at least an active layer over a substrate, the active region including a plurality of transistors therein. A plurality of dielectric interconnect layers are over the active region, and an opening is defined through the plurality of dielectric interconnect layers. The opening extends to at least the active layer. A barrier is within the plurality of dielectric interconnect layers and surrounding the opening. An optical element is positioned in the opening. The barrier prevents stress damage, such as cracks and/or delaminations, from propagating from or to the opening, and maintains the hermetic seal of the PIC structure.


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