Fujisawa, Japan

Koji Serizawa


Average Co-Inventor Count = 4.9

ph-index = 7

Forward Citations = 139(Granted Patents)


Location History:

  • Shonandai-Fujisawa, JP (1997)
  • Shonandai-Fujsawa, JP (1998)
  • Fujisawa, JP (2001 - 2011)

Company Filing History:


Years Active: 1997-2011

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9 patents (USPTO):Explore Patents

Title: Koji Serizawa: Innovator in Semiconductor Technology

Introduction

Koji Serizawa is a prominent inventor based in Fujisawa, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on enhancing the reliability and efficiency of electronic components.

Latest Patents

One of his latest patents is for an electronic component with varying rigidity leads using Pb-free solder. This invention proposes a semiconductor device that includes a semiconductor chip with multiple electrodes and leads that are electrically connected by bonding wires. The leads are made of different materials to provide varying rigidities, improving the overall performance of the device. Another notable patent is for a semiconductor device having solder bumps that are reliably reflow solderable. This invention addresses the heat resistance properties of circuit substrates and electronic parts, ensuring high reliability in solder bonding.

Career Highlights

Throughout his career, Koji Serizawa has worked with leading companies in the technology sector, including Hitachi, Ltd. and Renesas Technology Corporation. His experience in these organizations has allowed him to develop innovative solutions that have advanced semiconductor technology.

Collaborations

Koji has collaborated with notable colleagues such as Tetsuya Nakatsuka and Hanae Shimokawa. These partnerships have contributed to the success of his inventions and the advancement of the field.

Conclusion

Koji Serizawa's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.

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