The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2004
Filed:
Mar. 25, 2003
Tasao Soga, Fujisawa, JP;
Hanae Shimokawa, Yokohama, JP;
Tetsuya Nakatsuka, Yokohama, JP;
Masato Nakamura, Fujisawa, JP;
Yuji Fujita, Yokohama, JP;
Toshiharu Ishida, Fujisawa, JP;
Masahide Okamoto, Yokohama, JP;
Koji Serizawa, Fujisawa, JP;
Toshihiro Hachiya, Hitachinaka, JP;
Hideki Mukuno, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.