Hitachinaka, Japan

Hideki Mukuno



Average Co-Inventor Count = 7.5

ph-index = 2

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 2003-2017

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3 patents (USPTO):

Title: Innovations by Inventor Hideki Mukuno

Introduction

Hideki Mukuno is a notable inventor based in Hitachinaka, Japan. He has made significant contributions to the field of semiconductor devices and electronic equipment. With a total of 3 patents to his name, Mukuno's work focuses on improving measurement accuracy and reliability in electronic applications.

Latest Patents

Mukuno's latest patents include an adhesive sheet, a method for manufacturing a semiconductor device using the adhesive sheet, and a thermal airflow sensor. The thermal airflow sensor is designed to enhance measurement accuracy and includes a method for its manufacturing. The adhesive sheet is specifically engineered to be divided into multiple sections, each with a thickness of approximately 0.1 mm or less, which increases adhesion through external energy. Additionally, he has developed an electronic device that improves shock resistance and reliability in semiconductor applications, utilizing a lead-free solder composition.

Career Highlights

Throughout his career, Mukuno has worked with prominent companies such as Hitachi, Ltd. and Hitachi Automotive Systems, Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Mukuno has collaborated with notable coworkers, including Tasao Soga and Hanae Shimokawa. Their combined expertise has likely fostered a creative environment that encourages innovation.

Conclusion

Hideki Mukuno's contributions to the field of electronics and semiconductor technology demonstrate his commitment to innovation. His patents reflect a deep understanding of the challenges in the industry and a dedication to improving existing technologies.

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