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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9779976 B1

PDFFull Text
Date of Patent:
Oct. 03, 2017

Filed:

Apr. 18, 2014

Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor

Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Satoshi Ikeo, Hitachinaka, JP;

Toshifumi Sagawa, Hitachinaka, JP;

Ryosuke Doi, Hitachinaka, JP;

Hiroshi Kikuchi, Hitachinaka, JP;

Hideki Mukuno, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Chandra Chaudhari

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/683 (2006.01); C09J 7/00 (2006.01); C09J 201/00 (2006.01); G01F 1/692 (2006.01); G01F 1/684 (2006.01); H01L 21/78 (2006.01); C09J 7/02 (2006.01); G01F 5/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); G01F 15/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/00 (2013.01); C09J 7/02 (2013.01); C09J 201/00 (2013.01); G01F 1/6845 (2013.01); G01F 1/692 (2013.01); G01F 5/00 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); C09J 2203/326 (2013.01); G01F 15/10 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/298 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/1815 (2013.01);
Abstract

Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.

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Ikeo, Satoshi. (2017). Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor (U.S. Patent No. 9779976). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9779976

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